| 摘要 |
PURPOSE:To contain a diode in a package of the same size as a conventional package by disposing a diode in a space between the cover plate and the bottom plate of the package to connect it to base and emitter terminal conductors. CONSTITUTION:Lead mount type insulation sealing diodes 9 are connected in series by leads 10, and simultaneously connected by leads 10 to a base terminal conductor 6 and an emitter terminal conductor 7. Silicone resin 13 for covering a transistor chip 4 and epoxy resin 14 further thereon are poured in a package, and the diodes 9 are enclosed by the resin 14. The series connection of the diodes 9 is formed in a compact structure by bending the leads 10 to approach the molding resins of the diodes in parallel. Thus, they can be separated from transistors of heat generation sources to reduce its temperature rise. Accordingly, a current limit is not excessive together with the temperature of the transistor. It is not as well necessary to increase the package.
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