| 摘要 |
PURPOSE:To provide a device characterized by excellent moisture resistance, heat resistance and shock resistance and improved reliability, by providing a mounting part, wherein grooves for guiding bonding material to the entire bonding surface of a semiconductor chip and many holes, whose inner parts are expanded wider than the opening parts and which have bottoms, are formed in the rear surface; and providing an inner lead parts, wherein the same holes are formed in the upper and rear surfaces. CONSTITUTION:Guiding grooves 25-29, which guide bonding material to the entire bonding surface of a semiconductor chip 3, are provided in the bonding surface with the semiconductor chip 3. The inner part of a hole 21 is expanded larger than the opening part, and the bottom is provided in the hole 21. Many holes 21 are formed in the rear surface. Such a mounting part 5 is provided. Holes 21 having the same shape as that of above described holes having the bottoms are formed on the parts of the upper and rear surfaces of an inner lead part 9. For example, the guide grooves are constituted by the following grooves: the diamond shaped guide grooves 25, which are formed in radial patterns from the center; the guide grooves 27, which are formed in a diagonal pattern; and the L shaped guide grooves 29 formed at the four corners of the guide grooves 27. The holes 21 having the bottoms are arranged and formed in the longitudinal direction with respect to tab leads 7 and arranged and formed in the direction of the width with respect to the inner leads 9 and in a column pattern.
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