发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent electrostatic breakdown by coating the rear of a leadless package for an LSI with conductive foil. CONSTITUTION:Lead terminals 2 for a package for an LSI manufactured by an insulator material are brought into contact with the metallic foil of Al, etc., or conductive resin foil laminated on the rear of the package, and all terminals are brought to the same potential. The lead terminals are fixed to the package by using a member in which adhesives are applied previously to one part of the conductive foil. According to said constitution, the electrostatic breakdown of the LSI can be prevented.
申请公布号 JPS63248149(A) 申请公布日期 1988.10.14
申请号 JP19870081099 申请日期 1987.04.03
申请人 TOSHIBA CORP 发明人 TAKEUCHI BUNJI
分类号 H01L23/00;H01L23/50 主分类号 H01L23/00
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