| 摘要 |
PURPOSE:To obtain the title composition which can give a cured product excellent in heat resistance and is useful for laminated sheets, molding materials, etc., by mixing an epoxy resin with a specified imide compound. CONSTITUTION:A functional group-terminated imide compound (b) of formula III (wherein X is -NH2 or -OH, Ar1-2 are each an aromatic residue, and m and n are each 0-30, preferably, 0-4) is obtained by performing imidation etc. of an aromatic diamine (i) (e.g., 2,4-toluenediamine) and a compound (ii) of formula I and/or II (wherein R1 is H or 1-10C alkyl, preferably, a 1-3C alkyl, R2 is H, a 1-20C alkyl or alkoxyl, or OH, preferably, H or a 1-5C alkyl). An epoxy resin (a) having at least two epoxy groups in the molecule (e.g., bisphenol A epoxy resin) is mixed with component (b) in such an amount that the total of component (b) of other curing agents is 0.8-1.2g equivalent per g equivalent of component (a), and, optionally, a curing agent (cure accelerator), a filler, a flame retardant, a reinforcing agent, a surface-treating agent, a pigment, etc. (c).
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