| 摘要 |
PURPOSE:To perform the processing of sealing a package with good controllability and productivity by forming high thermal absorptivity shape or layer of thermoplastic resin on at least one of package sealing sections, heating it by radiating means to melt the sealing section and sealing the package. CONSTITUTION:A semiconductor element 3 is previously secured to a header 1 to be connected to an electrode 4 formed of a lead frame, a cap 2 is covered and sealed. The sectional shape of the bump 2a of the cap 2 is preferably formed in a sharp state to have good thermal absorptivity, i.e., to be easily melted when it is heated, but may be of other shape, such as a dome state. In case of sealing it, the bump 2a of the cap is brought into contact with the sealing part la of the header 1, suitably pressed, and, if the cap 2 is transparent, a laser light is, for example, transmitted from a direction A to irradiate the bump 2a. Then, since the bump 2a has a small shape and a low thermal capacity, it is easily melted by the heat of the laser. When it is melted, it is fusion- bonded to the sealing part of the header 1. Thus, the sealing step is simplified to improve productivity.
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