发明名称 PHOTOSENSITIVE HEAT-RESISTING MATERIAL
摘要 PURPOSE:To enable the fine working of the titled material with a direct light by introducing acetoxyphenyl, formyloxyphenyl or halogenoacetoxy phenyl group into a polyimide, thereby enabling to utilize a phototransitional reaction. CONSTITUTION:The titled material is composed of a polymer having a repeating unit shown by formula I wherein R1 is a divalent group, R2 is a tetravalent group having one or more aromatic rings, R3 is a group shown by formula II or III, R4 is 1-3C alkylene group, R5-R8 are each H or methyl group, (m) is 1-3, (n) is 1-4, (l) is an integer. Said polymer is formed by for example, polycondensating a halide derivative of dicarboxylic acid obtd. from a tetracarboxylic acid dianhydride and a diamine. And, the titled material is formed by applying the solution of said polymer on a substrate, followed by precuring the polymer solution to form a film. A fine pattern is formed by mounting the mask having a prescribed pattern on the obtd. film, and then by irradiating a light on the mask, developing, followed by allowing to carry out the imide formation of the mask by heating.
申请公布号 JPS6455554(A) 申请公布日期 1989.03.02
申请号 JP19870210237 申请日期 1987.08.26
申请人 NIPPON STEEL CHEM CO LTD 发明人 NOZAWA MASAYUKI;WADA KEIICHIRO;FURUKAWA NOBUYUKI
分类号 G03C1/72;G03F7/038;G03F7/039 主分类号 G03C1/72
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