CHEMICAL MECHANICAL POLISHING PAD AND METHOD OF MAKING SAME

摘要

A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ≧10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.

主权项

1. A chemical mechanical polishing pad, comprising:
a chemical mechanical polishing layer having a polishing surface, a base surface and an average polishing layer thickness, TP-avg, measured normal to the polishing surface from the base surface to the polishing surface; wherein the chemical mechanical polishing layer is formed by combining a poly side (P) liquid component and an iso side (I) liquid component; wherein the poly side (P) liquid component comprises from 1 to 5 wt. % of an amine carbon dioxide adduct; and from 25 to 95 wt % of a (P) side polyol which is a high molecular weight polyether polyol having a number average molecular weight, MN, of 2,500 to 100,000 and an average of 4 to 8 hydroxyl groups per molecule; wherein the iso side (I) liquid component, comprising at least one (I) side polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ≧10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate.