发明名称 PROCESSING METHOD FOR MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To perform a highly accurate processing assuredly by a method wherein only both sides of a copper foil to which an adhesive tape is attached is separated, a reference mark is defined by projecting light rays to it form one side, and a guide hole is bored in the position of a reference mark. CONSTITUTION:An inner layer plate 1 provided with a reference mark 1a and a copper foil 2 are overlapped interposing an epoxy resin glass cloth prepreg 3 between them and molded through hot pressing into a multilayer printed wiring board 5 for processing. One side adhesive tape 4 is attached to the place of the copper foil 2 which corresponds to the mark 1a. A set material 3' of the epoxy resin glass cloth prepreg 3 is not attached to the copper part 2a where the tape 4 is positioned. The mark 1a is defined by projecting light rays onto it from an underside after the part 2a is separated with the tape 4 and then a guide hole 8 is bored in the position of the mark 1a. By these processes, a highly accurate processing can be assuredly performed.
申请公布号 JPH01134994(A) 申请公布日期 1989.05.26
申请号 JP19870292783 申请日期 1987.11.19
申请人 AICA KOGYO CO LTD 发明人 ANDO MITSUO;MURAMATSU TATSUYOSHI;ITO SHOJI
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址