| 摘要 |
PURPOSE:To augment the mounting density thereby facilitating the handling and mounting by a method wherein multiple semiconductor chips are laminated to be sealed in a sealing vessel while the leads for the same signal are mutually connected to the signal wirings on a substrate through the intermediary of one electrode. CONSTITUTION:A sealing vessel 4 is formed of a cover member 3A comprising an insulator, intermediate members 3B-3E and a bottom member 3F while leads 5 of semiconductor chips 4 are held between the members 3B-3E. Besides, the chips 4 are insulated from one another by the gaps between them while the gaps between the members 3A-3F are bonded to one another by an insulating bonding agent to be sealed. Mounting electrodes 2 are formed taking U- shape from the surface to the bottom on the specified positions of the outer surface of the vessel 3, the leads 5 for the same signal are mutually connected to one of the electrodes 2 while respective electrodes 2 are connected to the signal wirings 7 on a substrate 6. Through these procedures, a semiconductor device in high mounting density and large capacitance can be manufactured to facilitate the handling and mounting by laminating multiple chips to be sealed easily. |
