| 摘要 |
PURPOSE:To gain a high chip alignment accuracy by equipping a prealignment equipment apart from a semiconductor chip supporting equipment. CONSTITUTION:This equipment has a guide rail 10 to mount and carry a lead frame RF, a lead frame conveyor unit A and a prealignment mechanism B which is placed apart from and in the transverse direction of a bonding point BP on the guide rail 10. Furthermore, the equipment is provided with a bonding stage unit C placed below the bonding point BP, a bonding tool driving unit D placed above the bonding point BP and a traverse mechanism E to move a semiconductor chip from the prealignment equipment B to the bonding tool unit C. Therefore, each part of the prealignment equipment, especially an alignment plate, is kept away from expansion or deformation by heat of a heating equipment. By this method, a high alignment of a semiconductor chip is ensured. |
