| 摘要 |
PURPOSE:To prevent a crack from generating in a sealing resin by a method wherein a die pad part is formed into a linear form. CONSTITUTION:A lead frame 1 is formed into a linear form. For example, a stripped lead frame member is meanderlingly arranged to form a die pad part 1A and a semiconductor element 3 is mounted on the part 1A to constitute a semiconductor device. An increase in the volume of the element 3 due to expansion on the part 1A is dispersed along a meanderlingly crawling line and a mechanical stress due to a difference in expansion coefficient between the element and a sealing resin 2 becomes very small. Moreover, by making the part 1A crawl meanderlingly, the element 3 can be stably mounted though the form of the lead frame is a linear form.
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