| 摘要 |
PURPOSE:To enable an electronic device to be packaged in the position inclined by an angle according to a limit of height of a packaging space, by mounting electronic elements so that one electronic element is spaced from an external electrode at the end face of a substrate by a distance larger than the other electronic element. CONSTITUTION:A packaged semiconductor device 1 is inclined by a predetermined angle theta with respect to the surface of a mother board 11. A semiconductor element 3 mounted on the side 2a of a substrate 2 opposed to said board surface of the mother board 11 is spaced from an external terminal 6 by a distance l larger than a distance m by which a semiconductor element 3 mounted on the other side 2b of the substrate is spaced from the external terminal. By arranging the semiconductor elements in this manner, the corner 7a of the semiconductor element 3 is spaced more from the distal end of the external terminal 6 on the substrate 2. Accordingly, the semiconductor device 1 can be inclined by a larger angle (90 deg.-theta) so that a packaging level (h) of the semiconductor device 1 as measured from the board surface can be decreased.
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