| 摘要 |
PURPOSE:To form a through-hole having high reliability efficiently at low cost by using a section, to which even a through hole section is shaped, as a conductor circuit section formed onto a supporter and shaping the thickness of the through-hole section in thickness thicker than that of a green sheet. CONSTITUTION:A conductor circuit section 2 is formed onto a supporter 1 through a screen printing method. Through-hole sections 20 in the conductor circuit section 2 are further lap-printed, and shaped in thickness considerably thicker than surface circuit sections 21. The thickness of the through-hole sections is set previously so as to be made thicker than the thickness of a green sheet to be manufactured. Ceramic slurry 30 is sheet-formed onto the supporter 1 in constant thickness, and dried and solidified. When the supporter is peeled from the green sheet 3 under the state, the conductor circuit section is left on the green sheet side, thus completing the manufacture of the green sheet. Accordingly, the thick through-hole sections are exposed from both surfaces of the green sheet, thus result-in the positive continuity of the surfaces and rears of each layer. |
