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发明名称
Solderable layer system
摘要
In a solderable layer system in which a conductor layer which is partially covered with a layer of solder is applied to a support, the solder layer consists of an alloy in which a reducing agent is contained. The alloy is preferably brass.
申请公布号
US4898791(A)
申请公布日期
1990.02.06
申请号
US19880152620
申请日期
1988.02.05
申请人
VDO ADOLF SCHINDLING AG
发明人
SCHURIG, DIETER
分类号
B23K1/20;B23K35/00;B23K35/30;H01L21/60;H05K3/24;H05K3/34
主分类号
B23K1/20
代理机构
代理人
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地址
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