发明名称 Solderable layer system
摘要 In a solderable layer system in which a conductor layer which is partially covered with a layer of solder is applied to a support, the solder layer consists of an alloy in which a reducing agent is contained. The alloy is preferably brass.
申请公布号 US4898791(A) 申请公布日期 1990.02.06
申请号 US19880152620 申请日期 1988.02.05
申请人 VDO ADOLF SCHINDLING AG 发明人 SCHURIG, DIETER
分类号 B23K1/20;B23K35/00;B23K35/30;H01L21/60;H05K3/24;H05K3/34 主分类号 B23K1/20
代理机构 代理人
主权项
地址