RESIN ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

摘要

A resin encapsulated semiconductor device having at least one semiconductor element (3) which has at least one electrical connection to a lead frame by means of a wire (1) which has been solid-state bonded at one end to said semiconductor element and at the other end to the lead frame, said element and wire being encapsulated hermetically with a resin (12). The wire (1) is made of Cu and is in the annealed state having a maximum elongation at room temperature of not more than 60% throughout its length between said bonded ends. Such a wire has low susceptibility to constriction or other local deformation.