| 摘要 |
PURPOSE:To improve the workability at the time of assembling by laminating semiconductor elements, in the manner in which the surfaces of the elements on which circuits are formed are made to face each other. CONSTITUTION:Inner leads 3a, 3b made of metal foils are thermally compression-bonded to electrodes on the respective circuit forming surfaces of semiconductor elements 1a, 1b, via bumps 2a, 2b. The two semiconductor elements 1a, 1b provided with the inner leads 3a, 3b are so laminated that the respective circuit forming surface sides are made to face each other. The inner leads 3a, 3b are thermally compression-bonded to the single surfaces of the outer leads 4, outside the region sandwiched by the two semiconductor elements 1a, 1b. Each or the above members is molded by using sealing resin 5. When this resin seal type semiconductor device is assembled, the inner leads 3 are fixed to each semiconductor element 1; the bumps 2 are previously formed on the electrode parts on the semiconductor element 1 by plating or thermal compression bonding; the inner leads 3 are thermally compression-bonded from above. Thereby the respective inner leads of the semiconductor elements are all bonded on the single surfaces of the outer leads. In the sealing process, the normal two-divided type metal mold can be used, so that the productivity at the time of assembling can be improved. |
