发明名称 STEPPED MULTILAYER INTERCONNECTION APPARATUS AND METHOD OF MAKING THE SAME
摘要 A stepped multilayer Printed Wiring Board (PWB) (10), having an increased number of wiring paths in selected regions, is comprised of a main multilayer PWB (12) having a sufficient number of layers (121,122,123...12n) to provide the lowest number of wiring paths required anywhere on the board. In regions where a larger number of wiring paths are required, a secondary, multilayer PWB section (22), having a sufficient number of layers (221,222,223) to provide the required additional number of wiring paths, is connected to the main PWB by a layer of anisotropically conductive material (30) sandwiched therebetween. A plurality of mechanical fasteners (33,33 min ), typically bifurcated or heat-staked plastic pins, extends through the secondary PWB section and the main PWB to hold one to the other. <IMAGE>
申请公布号 CA2073911(A1) 申请公布日期 1993.01.31
申请号 CA19922073911 申请日期 1992.07.15
申请人 AMERICAN TELEPHONE AND TELEGRAPH COMPANY 发明人 SCHOENTHALER, DAVID
分类号 H05K1/14;H01L21/58;H01L23/12;H05K1/11;H05K3/32;H05K3/36;(IPC1-7):H05K1/02 主分类号 H05K1/14
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