| 摘要 |
<p>PURPOSE:To provide a solid phase plating method which is good in productivity by pressing a solid electrolyte which exhibits a high ion conductivity to plating metal ions to a body to be plated and energizing this body via the electrolyte. CONSTITUTION:Silver ion conductive glass which is amorphous and has a high electric conductivity is used for the solid electrolyte 3. A pure silver anode rod of 2mmphi having 99.99% purity is used as the source for supplying the conductive silver ions of an anode 4. The silver ions move in the solid electrolyte 3 when a degreased and pickled copper plate having 1mm thickness is used as the anode of the body 1 to be plated and a current is specified to 0.35A with 10V impressed voltage. Electricity is then discharged on the surface of the copper plate which is the body 1 to be plated of the cathode and metal silver is deposited. The film forming speed of the silver plating is 1.75m/sec.</p> |
