| 摘要 |
<p>PURPOSE:To enable a boundary surface between a polyimide film and a sealing resin to be enhanced in adhesion and moisture resistance in a TCP provided with a polyimide film inside it by a method wherein the surface of the polyimide film coming into contact with sealing resin is subjected to a plasma treatment so as to improve the reliability. CONSTITUTION:A semiconductor element 4 electrically connected through the intermediary of bumps 3 are fixed to finger-shaped leads 1 formed on the surface of a polyimide film 2, and the semiconductor element 4 and its vicinity are sealed up with sealing resin. In a tape carrier package formed as above, the surface of the polyimide film 2 coming into contact with sealing resin is subjected to a plasma treatment so as to be modified in the quality. For instance, the semiconductor element 4 electrically connected through the intermediary of metal bumps 3 is bonded to the polyimide film 2 where the copper leads 1 are formed through a TAB method, a TCP not sealed up with resin is introduced into a plasma treatment device, and all the surface of the non- sealed semiconductor device is subjected to a plasma treatment.</p> |
