| 摘要 |
PURPOSE:To miniaturize the laminated electronic equipment as a chip type and to automatically mount it by forming a power divider or a combiner by multilayering plural transmission line blocks. CONSTITUTION:A transmission line block A is formed by combining a ceramic green sheet 21 provided with a line pattern 11 on one surface and a ceramic green sheet 24 provided with a ground pattern 14 on one surface. A similarly constituted transmission line block B and a transmission line block C are vertically laminated. In the state of overlapping a surface layer block D at the top part, side face electrodes 31, 32, 33, 34, 31a, 32a, 33a and 34a are provided and by burning them, a chip-shaped laminated body is formed. Then, a resistor R is provided on the surface of the surface block D. By providing the side face electrodes, the equipments are turned to surface mounted equipments and no thick line is not required for line patterns 11, 12 and 13 of the respective blocks A, B and C. Further, either C coupling or M coupling is not generated between the line patterns. |
