发明名称 MOLDING DEVICE FOR RESIN BASE AND RELEASE METHOD FROM MOLDING DEVICE FOR RESIN BASE
摘要 <p>PURPOSE:To provide a molding device for releasing surely a resin base after molding the resin base and the releasing method thereof. CONSTITUTION:A mold device comprises a stamper 2, an inner periphery presser 3 for fixing the stamper 2, first and second molds 1 split into two, a heater for heating resin and a means of flowing heated resin into the first and second molds 1, and a flow inlet 8 for gas is formed on a section where the stamper 2 is not in touch with on the face of a mold 1 with which the stamper 2 is brought into contact, and gap is allowed to flow in from said flow inlet 8 at the time of releasing so that the resin base can be released securely from the stamper 2 even when static is generated by friction at the time of molding the resin base.</p>
申请公布号 JPH05245880(A) 申请公布日期 1993.09.24
申请号 JP19920047410 申请日期 1992.03.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 INOUE KAZUO
分类号 B29C45/26;B29C45/43;G11B7/26;(IPC1-7):B29C45/26 主分类号 B29C45/26
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