发明名称 Verfahren zur Kontaktierung von Schirmblechen.
摘要 A method for contacting shielding plates having press-in pins and attached to an upper side of a printed circuit board to further shielding plates also having press-in pins and located on a lower side of the printed circuit board. The upper shielding plate with press-in pins having arcuate press-in zones is placed free of force into respective through-contacted printed circuit board holes and is contacted against walls of the holes by pressing into the same holes press-in pins having V-shaped press-in zones of the lower shielding plate in order to achieve a gas-tight, good contacting, i.e. a shielding diverter.
申请公布号 DE59003478(D1) 申请公布日期 1993.12.16
申请号 DE1990503478 申请日期 1990.05.16
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 SEIDEL, PETER, DIPL.-ING., D-8038 GROEBENZELL, DE;ZELL, KARL, DIPL.-ING., D-8134 NIEDERPOECKING, DE
分类号 H01R12/50;H05K9/00;(IPC1-7):H05K9/00;H01R23/68 主分类号 H01R12/50
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