| 摘要 |
PURPOSE:To reduce the strain in the resin at the corners under a tab, thereby preventing reflow cracks due to steam pressure, by providing a hole of specific shape through which resin adheres to the tab. CONSTITUTION:A lead frame comprises a tab 4 for receiving a semiconductor chip 4, and leads 7 formed integrally with the tab and extending from its peripheries. The tab includes a hole 2 underneath the chip, and a recess 17 around the opening of the hole to hold molding resin when the chip is molded. As a result, the molding resin 5 is held at a shorter length under the tab when the resin is separated from the tab. This reduces the strain in the resin caused by steam pressure, thereby preventing reflow cracks.
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