| 摘要 |
<p>PURPOSE:To eliminate the possibility of deformation, positional shifting and variations in joint rigidity occurring at the time of forming cover tape-to-carrier tape joint to store and transport semiconductor parts using the carrier tape. CONSTITUTION:Cover tape 1 and carrier tape 3 are provided on their joint faces with rail-like projections 2 and grooves 4 having rail-like cross section, respectively, whereby the projections and the grooves are engaged under pressure. Since this joint is of a chuck structure, no breakage occurs upon disengagement and, therefore, the tapes are reusable.</p> |
