| 摘要 |
<p>PURPOSE:To provide a multiple lead frame for a semiconductor element package with electric noise abated capable of realizing narrow pitch and multiple pins. CONSTITUTION:This multilayer lead frame is composed of electrical connecting members 1a, 1b with conductors 3 whose both ends are exposed from holders 2 comprising polyimide resin, two each of metallic sheets 12a, 12b to be a power supply layer and a grounding layer as well as a lead frame 13 held by these two each of metallic sheets 12a, 12b to be connected by said connecting members 1a, 1b.</p> |
