| 摘要 |
The invention relates to the encapsulation of integrated circuit chips, in particular with a view to incorporating them in a chip card. …<??>The method of encapsulation comprises formation of a pre-blanked metal conductive grid (10), the formation of a pre-perforated plastic strip (20), the transferring of the strip onto the grid, the placement of an integrated circuit chip (26) into a perforation (22) of the strip, and the formation of electrical connections between the chip and zones (14) of the grid which are situated in perforations (24) of the strip. The perforations (22, 24) of the strip and the blanks of the grid are arranged in such a way that the strip covers over and plugs all the interstices (16) between conductors of the grid in the useful region corresponding to a module to be produced. When a protective resin is laid, the latter is confined and does not escape through the interstices of the grid. A plastic or metal ring defines the height dimension of the micromodule. …<IMAGE>… |
