| 摘要 |
PURPOSE:To provide conductive resin paste which does not generate any void when it hardens, can be hardened within one minute on a hot plate, has an excellent adhesive strength against the surfaces of various kinds of substrates, and can be reduced in thermal stress after hardening. CONSTITUTION:The title paste is composed of an epoxy resin having two or mote epoxy groups in one molecule, phenolated polybutadiene having two or more phenolic hydroxyl groups in one molecule, and conductive filler. This invention also relates to a semiconductor device using the paste. |
