| 摘要 |
<p>PURPOSE:To provide a probe device which can raise the heat radiation efficiency of a semiconductor element without needing the increase of weight, change of a drive system, or the like by simple structure. CONSTITUTION:A placing tray 28 consisting of a thin plate using a material more excellent in heat conductivity than a chuck 26 is interposed between the chuck 26 and an object 16 to be inspected. Accordingly, the heat from the object 16 to be inspected is diffused and absorbed at the placing tray 28, whereby heat adsorption efficiency is improved. Hereby, it becomes possible to improve the heat radiation efficiency of the object 16 to be inspected by suppressing the increase of weight or the increase of load to drive system of the placing part.</p> |
