发明名称 CHITSUKAARUMINIUMUBUHINNOSEIZOHOHO
摘要 PURPOSE:To obtain an aluminum nitride component in which aluminum nitride rigidly adheres to a metallized layer by coating an aluminum nitride member with metallized paste and then baking it in a predetermined atmosphere. CONSTITUTION:An aluminum nitride baked substrate 1 is coated with Mo-Mn series metallized paste 2. Then, the substrate 1 coated with the paste is introduced into a baking furnace, and baked at 1250-1450 deg.C in a reducing atmosphere, thereby forming a metallized layer 2. An alumina Al2O3 layer 3 having 0.2-20mum of thickness is formed on the whole surface of the substrate 1 in this baking step. Then, after a nickel plating layer 4 is formed on the whole surface of the layer 2, leads 6 are brazed with a silver brazing material 5.
申请公布号 JPH0666546(B2) 申请公布日期 1994.08.24
申请号 JP19870245749 申请日期 1987.10.01
申请人 NIPPON GAISHI KK;NICHIGAI SERAMITSUKUSU KK 发明人 SUZUKI TAKESHI;SATO AKIHIRO
分类号 H05K1/03;C04B41/90;H01L23/15;H05K1/05;H05K1/09;H05K3/12;H05K3/38;(IPC1-7):H05K3/38 主分类号 H05K1/03
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