| 摘要 |
<p>PURPOSE:To surely form a solder bonded part between a lead and a through hole in an electronic-component mounting device. CONSTITUTION:Two each of through holes 12 are arranged for each of a plurality of inner leads 21 installed on the through holes 12 in a wiring board. Solder is made to rise through the inside of the through holes 12 from the back side of the wiring board, the solder which has swollen out to the surface side of the wiring board comes into contact with the inner leads 21, and solder bonded parts are formed between the inner leads 21 and the through holes 12. At this time, when at least one through hole 12 out of two is bonded by the solder, the bonded part of the wiring board to the lead is regard as a good product. Consequently, the yield of the formation of the solder bonded parts between the inner leads 21 and the through holes 12 is increased sharply, and the cost of an electronic-component mounting device can be reduced. In addition, the solder bonding strength between the inner leads 21 and the through holes 12 can be increased further.</p> |
