| 摘要 |
PURPOSE:To provide a deeply drawn curved surface multilayer interconnection board having a semispherical shape, etc., having large curvatures of two directions by forming a conductor layer having a uniform thickness without wrinkle and crack on an insulating layer of an arbitrarily curved surface shape. CONSTITUTION:After a curved surface layer is formed at a prepreg 2 by a press 5 in a base forming step 1a, it is copper-plated 6 to manufacture a base board. Then, a building-up step 7a of repeating at least once or more the steps of forming an inner layer pattern by laser exposure (five-axis NC) 9, forming the prepreg 9 with a curved surface layer by the press 5, and then copper-plating 6 the layer is executed, and then a layer connecting step of forming a through hole and an outer layer pattern forming step are conducted. |
