| 摘要 |
<p>PURPOSE:To prevent occurrence of insufficiently sealed chip due to deformation or breakage of an adhesive pattern caused by pressurization and heating in the step for bonding the upper and lower stopper wafers to a center wafer when a semiconductor acceleration sensor is fabricated. CONSTITUTION:A circular pattern 6 of adhesive for preventing the chipping is formed on the outer peripheral part of a stopper wafer. Since the grid pattern 7 of sealing adhesive applied to the inside of wafer and the circular pattern 6 do not form any enclosed space, the variation of the space between the stopper wafer and a center wafer and the expansion of air caused by the pressurization and heating of the wafer have no effect on the sealing adhesive which is not thereby deformed nor broken. The sealing adhesive may have a linear pattern extending in a predetermined direction.</p> |
