| 摘要 |
PURPOSE:To supply a product having good characteristics and a high reliability. CONSTITUTION:A base substrate 22 is made of a glass thermosetting polyphenylene-oxide resin. Since the glass thermosetting polyphenylene-oxide resin is superior in heat resistance to a conventionally used glass epoxy resin and has a higher characteristic stability against temperature, the appearance and characteristics are less changed before and after reflow solder. Further, the product of good high frequency characteristics is produced because dielectric loss tangent tandelta of the glass thermosetting polyphenylene-oxide resin is good. Since this resin has proper dielectric constant epsilonr in comparison with Teflon glass, a pattern having a capacity is not made too large to miniaturize the product, and this resin is characterized by inexpensive materials. Consequently, the product which has good high frequency characteristics and has the solder heat resistance improved and has a high reliability is supplied without increasing the cost. |
