发明名称 SEMICONDUCTOR MOLDING DEVICE
摘要 PURPOSE:To move an upper platen keeping the mating faces of molding dies in parallel so as to prevent flashes from occurring by a method wherein an upper and a lower molding die provided between an lower plate and a movable plate are matched to each other, clamped, and then opened by moving the movable plate up or down. CONSTITUTION:An auxiliary upper plate 16 is moved to an optional position by turning a screw 17 corresponding to a set mold-clamping pressure. When an upper molding die 9 and a lower molding die 10 are clamped, a servo-motor 11 is driven detecting an angle of extension of the toggle of a toggle-type drive mechanism by an encoder 15, and the toggle of the toggle-type drive mechanism is extended as much as possible through the intermediary of a timing belt 12 and a pole screw 13. By this setup, an auxiliary upper plate or an upper molding die is moved by a screw, so that an upper platen can be moved keeping the mating faces of an upper and a lower molding die in parallel, and flashes are prevented from being produced.
申请公布号 JPH07135233(A) 申请公布日期 1995.05.23
申请号 JP19930282191 申请日期 1993.11.11
申请人 TOSHIBA CORP 发明人 TOYODA YASUHIRO
分类号 B29C43/36;B29C43/18;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C43/36
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