Semiconductor manufacturing apparatus.

摘要

The upper surface of a stage (20) has first, second and third surfaces (21, 22, 23) formed in a stepped configuration, the first and second surfaces (21, 22) are connected to each other by a first side surface (21a) and the second and third surfaces (22, 23) are connected to each other by a second side surface (22a). A circular arc-form concave portion (24) is formed in the side surface (21a) and a chip carrier (41) is disposed on the second surface (22) inside the concave portion (24). A depressing plate (26) is disposed on the second surface (22) so as to freely slide in a direction perpendicular to the first side surface (21a). The depressing plate (26) is fixed on a clamp member (27) which is connected to a rotor (30) rotatably mounted on the stage (20). The rotor (30) is biased by means of a spring so as to move the depressing plate (26) towards the concave portion (24). The depressing plate (26) has a depressing portion (25) which is set in parallel with the first side surface and the position of the chip carrier (41) is determined by the depressing portion of the depressing plate (26) and the internal surface of the concave portion (24).