| 发明名称 |
Electronic Devices with Increased Creepage Distances |
| 摘要 |
A device includes an encapsulation material and a first lead and a second lead protruding out of a surface of the encapsulation material. A recess extends into the surface of the encapsulation material. An elevation is arranged on the surface of the encapsulation material. The first lead protrudes out of the elevation. |
| 申请公布号 |
US2016365296(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
US201615176952 |
申请日期 |
2016.06.08 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Otremba Ralf;Fuergut Edward;Kasztelan Christian;Kuek Hsieh Ting;Lee Teck Sim;Murugan Sanjay Kumar;Wang Lee Shuang |
| 分类号 |
H01L23/31;H01L21/56;H01L21/48;H01L23/495;H01L23/29 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device, comprising:
an encapsulation material; a first lead and a second lead protruding out of a surface of the encapsulation material; a recess extending into the surface of the encapsulation material; and a first elevation arranged on the surface of the encapsulation material, wherein the first lead protrudes out of the first elevation. |
| 地址 |
Neubiberg DE |
