| 摘要 |
<p>PURPOSE: To provide an aligning method and a device therefor that can shorten aligning time by a large margin even to a wafer with numerous fail marks. CONSTITUTION: Prior to alignment, the whole surface image of a wafer 12 with numerous chips arrayed is picked up by a wafer image pickup device, and the chips with fail marks and the chips without fail marks are discriminated by a discriminator 28 from the image data. On the basis of the discrimination result, only the chips without fail marks are found to align the wafer 12 into a desired position.</p> |
