Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen
摘要
Electrode terminals formed on a pair of a circuit substrate and another circuit substrate or electrical element are mutually connected electrically by the medium of electroconductive particles. Prior to the connection, the electroconductive particles (4) may be charged and dispersed onto a circuit substrate (11) to be selectively attached to the electrode terminals (8) thereon. The selective attachment may be enhanced by masking a part other than the connecting part of the electrode terminals (8) of the circuit substrate with an insulating member or film (10) so as to guide the charged electroconductive particles (7) along electric lines of force directed to the exposed parts of the electrode terminals. The attached electroconductive particles (9) are sandwiched between the pair of circuit substrates, which may be secured to each other by means of an insulating adhesive or an electroconductive resin.
申请公布号
DE69026992(D1)
申请公布日期
1996.06.20
申请号
DE1990626992
申请日期
1990.08.16
申请人
CANON K.K., TOKIO/TOKYO, JP
发明人
TAKABAYASHI, HIROSHI, OHTA-KU, TOKYO, JP;TAKAHASHI, MASANORI, OHTA-KU, TOKYO, JP