| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A semiconductor package includes a first substrate, a first conductive layer, a first surface mount device (SMD) and a first bonding wire. The first substrate has a first top surface. The first conductive layer is formed on the first top surface and has a first conductive element and a second conductive element separated from each other. The first SMD is mounted on the first top surface, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer. |
| 申请公布号 |
US2016300812(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615185063 |
申请日期 |
2016.06.17 |
| 申请人 |
MEDIATEK Inc. |
发明人 |
Chen Nan-Jang |
| 分类号 |
H01L23/00;H01L23/31;H01L27/32;H01L23/60;H01L23/498;H01L23/367 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a first substrate having a first top surface; a first conductive layer formed on the first top surface and having a first conductive element and a second conductive element separated from each other; a first surface mount device (SMD) mounted on the first top surface, overlapping with and electrically isolated from the first conductive element; and a first bonding wire electrically connect the first SMD with the first conductive layer. |
| 地址 |
Hsinchu TW |
