| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting board of high reliability wherein IC's to be used in an electronic computer, a work station, etc., are directly mounted, and the thermal expansion coefficient is controlled. SOLUTION: Conductor wiring is directly formed on the surface of an organic polymer film 1 wherein the coefficient of linear thermal expansion is -5×10<-6> /K-5×10<-6> /K and the elastic modulus (Young's modulus) is at least 7GPa. The organic polymer films having conductor wiring are laminated via adhesive films 2 whose elastic modulus (Young's modulus) is at most 7GPa. The conductor wirings of the respective layers are electrically connected by using through holes 4 or non-penetrating holes which are turned into conductor. IC chip's 8 are directly connected with the conductor wiring formed on the organic polymer film surface and mounted thereon.</p> |
