| 摘要 |
<p>PROBLEM TO BE SOLVED: To make the flatness of a surface excellent and to improve a mechanical strength by a method wherein a communication IC module is provided in a recess of a card base, an unhardened sealing resin is filled in the recess of the card base, a plastic sheet coated with a bonding agent is fitted on the upper surface of the card base and heat treatment is conducted to harden the sealing resin. SOLUTION: A plastic sheet 11 is fitted on the lower surface of a card base 12 by a bonding agent 10 so that a recess of the card base is formed. A communication IC module 7 is provided in this recess of the card base. The plastic sheet 11 is fitted on the upper surface of the card base 12 by the bonding agent 10 so that it covers the recess of the card base. The recess of the card base is filled with sealing resin 9 and thereby the communication IC module 7 is protected.</p> |
