| 摘要 |
<p>PURPOSE:To provide an IC tray which has an improved heat resistance and is inexpensive by using a resin composition obtained by blending polyphenylene eter resin and aromatic series polycarbonate resin, conductive carbon, and acid imide compound in specific ratio and then by fluxing-kneading it. CONSTITUTION:A heat resistant tray for IC is formed by using a composition 100 pts.wt. consisting of (A) polyphenylene eter resin 10-90wt.% and aromatic series polycarbonate resin 90-10wt.% and a resin composition consisting of (B) conductive carbon 3-40 pts.wt. Adding an acid imide compound of 0.1-30 pts.wt., preferably 1-20 pts.wt. to (A) constituent 100 pts.wt. improves flow of this composition and forming machinability. Also, even if a glass fiber is added, reduction in flow is small, thus improving stability of dimensions and heat resistance.</p> |
