发明名称 EVALUATION CONNECTOR PACKAGING SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To prevent inability in measurement due to the existence of a part packaging surface by a method wherein a evaluation connector for applying a measuring instrument in the case of evaluation time in a trial stage, etc., is provided even on a part packaging surface of a packaging substrate inside this evaluation connector packaging substrate in a pair set composition. SOLUTION: This evaluation connector packaging substrate is formed of the assembling connectors 1, 2 fitted to the first packaging substrate 9, the evaluation connectors 5, 6 tacked on the opposite surface to the connectors 1, 2, the other assembling connectors 3, 4 fitted to the second packaging substrate 10 and said substrate 9 to be coupled with said assembling connectors 1, 2 including the other evaluation connectors 7, 8 connectable to the evaluation connectors 5, 6. In such a constitution, the substrates 9 and 10 are electrically connected by the evaluation connectors 5, 6, 7, 8 while the probe of a measuring instrument can be applied to the substrates 9 and 10 having the assembling connectors 1, 2, 3, 4, thereby preventing a inability in measurement due to the existence of a part packaging surface.</p>
申请公布号 JPH09312456(A) 申请公布日期 1997.12.02
申请号 JP19960126875 申请日期 1996.05.22
申请人 NEC SHIZUOKA LTD 发明人 SATO MASAKI
分类号 G06F1/18;H05K1/14;(IPC1-7):H05K1/14 主分类号 G06F1/18
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