发明名称 Semiconductor structure with insertion layer and method for manufacturing the same
摘要 A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate, an interfacial layer formed over the substrate, and an insertion layer formed over the interfacial layer. The semiconductor structure further includes a gate dielectric layer formed over the insertion layer and a gate structure formed over the gate dielectric layer. In addition, the insertion layer is made of M1Ox, and M1 is a metal, O is oxygen, and x is a value greater than 4.
申请公布号 US9515158(B1) 申请公布日期 2016.12.06
申请号 US201514918054 申请日期 2015.10.20
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 Lian Cheng-Wei;Wang Chih-Lin;Kuo Kang-Min;Lin Chih-Wei
分类号 H01L29/78;H01L29/51;H01L29/423;H01L21/28;H01L21/02 主分类号 H01L29/78
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A semiconductor structure, comprising: a substrate; an interfacial layer formed over the substrate; an insertion layer formed over the interfacial layer; a gate dielectric layer formed over the insertion layer; and a gate structure formed over the gate dielectric layer, wherein the insertion layer is made of M1Ox, and M1 is a metal, O is oxygen, and x is a value greater than 4.
地址 Hsinchu TW