发明名称 |
Semiconductor structure with insertion layer and method for manufacturing the same |
摘要 |
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate, an interfacial layer formed over the substrate, and an insertion layer formed over the interfacial layer. The semiconductor structure further includes a gate dielectric layer formed over the insertion layer and a gate structure formed over the gate dielectric layer. In addition, the insertion layer is made of M1Ox, and M1 is a metal, O is oxygen, and x is a value greater than 4. |
申请公布号 |
US9515158(B1) |
申请公布日期 |
2016.12.06 |
申请号 |
US201514918054 |
申请日期 |
2015.10.20 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
Lian Cheng-Wei;Wang Chih-Lin;Kuo Kang-Min;Lin Chih-Wei |
分类号 |
H01L29/78;H01L29/51;H01L29/423;H01L21/28;H01L21/02 |
主分类号 |
H01L29/78 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A semiconductor structure, comprising:
a substrate; an interfacial layer formed over the substrate; an insertion layer formed over the interfacial layer; a gate dielectric layer formed over the insertion layer; and a gate structure formed over the gate dielectric layer, wherein the insertion layer is made of M1Ox, and M1 is a metal, O is oxygen, and x is a value greater than 4. |
地址 |
Hsinchu TW |