| 摘要 |
<p>The manufacturing method of a laminated film which is composed of a photosensitive layer and a first film whose 5 % elongation load for a unit width in the film lengthwise direction is 4-90 g/mm at 80 °C and whose breaking elongation in the same direction is 50-100 % at 80 °C and the manufacturing method of a printed wiring board wherein the laminated film is applied to the board so as to bring the photosensitive layer into contact with the printed wiring board and the exposure and the development are performed are provided.</p> |
