| 摘要 |
<p>A metal-ceramic composite comprised of a metal member bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880 °C, and metal-ceramic composites that are so constructed as to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with ferrite or alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, EMI shields and higher level assemblies including such devices.</p> |
