| 发明名称 |
LIGHT-EMITTING DIODE PACKAGE |
| 摘要 |
An LED package includes a substrate, a light-emitting structure provided on the substrate, an electrode structure provided on the light-emitting structure, and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis. The major axis of the external connection terminal is perpendicular to a cleaving plane of the substrate. |
| 申请公布号 |
US2016372646(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615147315 |
申请日期 |
2016.05.05 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOON Ju-heon;KIM Hak-hwan;KIM Dae-sup;KIM Jeong-hee;SHIN Dong-myung;YUN Kwang-seok |
| 分类号 |
H01L33/62;H01L33/32;H01L33/38;H05B37/02;H01L33/54;H01L33/50;H05B33/08;H01L33/16;H01L33/22 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting diode (LED) package comprising:
a substrate; a light-emitting structure provided on the substrate; an electrode structure provided on the light-emitting structure; and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis, wherein the major axis of the external connection terminal is perpendicular to an m(10-10) plane of the substrate. |
| 地址 |
Suwon-si KR |
