| 摘要 |
A solder alloy according to the present invention contains tin (Sn), lead (Pb), silver (Ag), antimony (Sb), and copper (Cu) according to the following composition: 64 to 66 percent by weight of Sn, 0.8 to 1.5 percent by weight of Ag, 0.3 to 1.0 percent by weight of Sb, 0.1 to 0.25 percent of Cu, and the balance being Pb. The resulting solder alloy has improved characteristics in high strain thermal fatigue, low strain thermal fatigue, high temperature creep, mechanical fatigue, interfacial strength, and impact strength, as compared with those of a conventional solder alloy. The solder alloy has wide application such that it can be used in an automatic solder apparatus of a jet stream system, the strength thereof can be improved without deteriorating solderability, and the strength of the connecting portion between elements can be improved without altering present designs or packaging equipment.
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