| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board where a blind via hole without occurrence of damage of an inner layer conductor circuit by laser beam and besides having sure conductivity can be made. SOLUTION: This method can manufacture a printed wiring board which has inner layer conductor circuits 161 and 131 provided between insulating layers 101-103, and blind via holes 141 and 142 arranged toward the inner layer conductor circuit from the outermost surface of the insulating layer. At this time, the inner layer conductor circuit 161 positioned at the bottom of the blind via hole 141 is provided with an opening 160 in advance at the center, and a laser beam is applied to it from the outermost surface of the insulating layer so as to form blind via holes 141 and 142. After that, metallic plated films are made on the surfaces of the inner layer conductor circuits 131 and 161 and the blind via holes 141 and 142. |
