Solder void reduction between electronic packages and printed circuit boards

摘要

A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

主权项

1. A method comprising:
fabricating a printed circuit board, wherein the fabricating comprises,
forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane;forming a second dielectric layer on top of the at least one conductive layer;forming a thermal pad on top of the second dielectric layer, wherein an electronic package is to be soldered on top of the thermal pad;forming at least one through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer;filling the at least one through hole with a conductive material to form at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer; andbackdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.